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The Advanced Thermal Model is a premium component that models junction-to-ambient heat transfer via conduction, convection, and radiation. It is suitable for PCB components, power semiconductors, and custom thermal packages.

Physics

The component solves a combined conduction/radiation heat balance:
  1. Initial estimate: T_case = T_amb + P × R_ca (pure conduction)
  2. Radiation correction loop (up to 20 iterations, converges when ΔT < 1e-6 K):
    • P_rad = ε × σ × A × (T_case⁴ − T_amb⁴)
    • P_conv = max(0, P − P_rad)
    • T_case = T_amb + P_conv × R_ca
  3. T_junction = T_case + P × R_jc
Where σ is the Stefan-Boltzmann constant (5.67 × 10⁻⁸ W/m²K⁴).

Ports

Parameters

Example

When to use this component

  • Estimating MOSFET or IGBT junction temperature under load
  • Comparing heatsink options by adjusting thermal_resistance_ca
  • Modelling radiation effects at elevated case temperatures
  • Coupling with power electronics components in a larger simulation graph
This component requires a Hardwave premium subscription. See Premium Components for setup instructions.